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Raymond Leung

Executive Director/director Of Engineering - Payments, Reporting & Data Infrastructure (wepay) at JPMorgan Chase & Co.

Raymond Leung is a highly experienced engineering leader with a strong background in payments infrastructure and software engineering. Currently serving as a Senior Engineering Manager at WePay since September 2018, Raymond has previously held multiple engineering management and senior software engineering roles at AppDirect, Rocket Lawyer, and Oracle. With a Master of Engineering in Computer Science from Cornell University and a Bachelor of Science in Computer Science from The University of Texas at Austin, Raymond combines technical expertise with leadership skills to drive successful engineering initiatives.

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