Ryan Cheng is a Senior Engineer at 宜特科技股份有限公司 (iST) since June 2013, specializing in FIB circuit analysis and modification, particularly in advanced copper processes below 28nm, WLCSP, and complex backside circuitry. As a department coach, Ryan plays a crucial role in training new personnel. Previous roles included Engineer and Assistant Engineer at iST, where Ryan focused on circuit defect analysis and modifications for both aluminum and copper processes ranging from 90nm to 40nm. Prior to iST, Ryan worked as an Equipment Engineer at 瑩諮科技, maintaining gas monitoring and measurement equipment for various sectors, including government environmental agencies and automotive manufacturers. Ryan holds a bachelor's degree in Electrical Engineering from National Penghu University of Science and Technology, awarded between 2007 and 2010.
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