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Anshuma Pathak, Ph D, has extensive experience in the field of package reliability and semiconductor technology. Currently serving as Senior Manager of Package Reliability at Infineon Technologies since October 2021, Anshuma has previously held roles as Process Development Manager at PacTech - Packaging Technologies from January 2016 to September 2021, and as a Research Scientist at the Institute for Nanoelectronics, TU Munich from March 2013 to 2016. Anshuma started as a scientific staff member at the Institute of Semiconductor Technology, TU Braunschweig from September 2009 to February 2013. Anshuma holds a Master's degree from Gauhati University.