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Daniel Lu has a diverse work experience in various roles and industries. Daniel started their career as a Materials Engineer Intern at National Starch and Chemical Co. in 1997, where they investigated the mechanisms underlying the unstable contact resistance of electrically conductive adhesives (ECAs) for solder replacement. Daniel successfully developed ECAs with substantially stable contact resistance.

In 1998, Daniel worked as a Packaging Engineer Intern at Amoco Electronic Materials. Daniel then joined Lucent in 2000 as a Process Engineer, where they developed technologies to package high-performance optoelectronics components for high-speed optical communication. During their time at Lucent, they successfully demonstrated the first 40Gb/s receiver in the world.

In 2001, Daniel joined Intel Corporation as a Sr. Scientist and worked there until 2008.

Daniel's most recent work experience was at Henkel Corporation, where they held various roles. Daniel started as a Technical Director from 2008 to 2009. Daniel then became the Head of Product Development and Application Engineering from 2014, and their current end date is unknown.

Daniel Lu completed a Bachelor of Science degree in Chemistry from East China Normal University in 1990. Daniel then pursued a Master of Science degree in Polymer Science and Engineering at Georgia Institute of Technology from 1994 to 1996. Finally, they obtained a Doctor of Philosophy (Ph.D.) degree in Materials Science and Engineering from Georgia Institute of Technology from 1996 to 2000.