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Brent Yoon is a highly experienced director at GCT Semiconductor, with a career that includes significant roles in package development and engineering since May 2011. At GCT Semiconductor, Brent Yoon manages package development processes, focusing on RFQ for assembly sites, collaboration with internal design teams, and high-volume manufacturing setups for various packaging technologies including FBGA and hybrid packages for wireless telecommunications. Previous experience includes serving as a process engineer at SFA Semicon, where Brent Yoon specialized in package development for NAND flash cards and implemented process improvements for advanced packaging techniques. Early career experience includes a role as a process engineer at MEC, with a focus on SMT processes. Brent Yoon holds a Master of Engineering in Material Science and Engineering from Korea University and a Bachelor of Engineering in Materials Engineering from Incheon National University.