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Kurinchi B. has extensive experience in engineering, particularly in high-speed interface applications and FPGA technologies. At Intel Corporation, roles included Engineering Manager and lead for FPGA PCIe Accelerator Card qualification, alongside responsibilities as an FPGA Application Engineer focused on Ethernet, 5G, and SERDES. Previous positions include Design/Characterization Engineer at Vitesse Semiconductor (now Microsemi), DSP Engineer at Singalogic, and Product Engineer at Wipro Technologies. Kurinchi B. holds a Master of Science in Electrical and Electronics Engineering from The University of Texas at Dallas and a Bachelor of Engineering in Electronics and Instrumentation from Kongu Engineering College.