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Syed Sajid Ahmad is an experienced professional in the field of advanced packaging and semiconductor assembly, currently serving as the Director of Advanced Packaging at CrossFire Technologies, Inc. since 2018. In addition, Syed has been a Research Staff member at ECE, NDSU since July 2015 and previously held the position of Manager of Engineering Services at CNSE NDSU from August 2003 to June 2015. Syed's extensive background includes significant roles at Micron Technology, GigaBit, National Semiconductor, and Intel Corporation, focusing on research, development, and quality assurance of advanced packaging techniques and semiconductor materials. Syed earned a Doctor of Philosophy in Engineering from North Dakota State University between 2004 and 2020.