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Bonnie Thompson is an experienced Failure Analysis Engineer currently employed at Central Semiconductor Corp. since 2016, specializing in quality assurance and troubleshooting customer quality issues. Prior to this role, Bonnie spent 16 years at Microchip Technology Inc., where success was achieved in managing failure analysis projects and ensuring timely customer support. Bonnie's earlier experience includes positions at SMSC, Northrop Grumman Corporation, and Grumman Corporation, with a strong emphasis on electrical and physical failure analysis, laboratory management, and quality assurance testing. Educational background includes a Bachelor’s Degree in General Studies with concentrations in Engineering, Life Sciences, and Math/Physics from the New York Institute of Technology.