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Priyal Singh is an experienced R&D Engineer in IC Design, currently employed at Broadcom since October 2024. Previously, Priyal held the position of Staff Engineer at EdgeQ Inc. from November 2019 to October 2024, where leadership in synthesis and place-and-route implementation across various TSMC process nodes was demonstrated, successfully meeting performance, power, and area targets. Prior to that, Priyal was a SoC Design Engineer at Intel Corporation from January 2018 to October 2019, focusing on the physical design implementation of a 5G modem block. An early internship at Intel involved gaining foundational knowledge in physical design, while a winter internship at TI-CEPD provided additional industry experience. Priyal Singh holds a Bachelor of Technology in Electrical, Electronics, and Communications Engineering from Vellore Institute of Technology, completed in 2018.