Pin Heng, Alex Lai, currently serves as Department Manager in Central Development Engineering and Customer Engineering Integration at ASE Group Global since February 2013, focusing on wafer bumping to flip chip solutions and new product introduction engineering. Prior experience includes managing Asia manufacturing at Neoconix, Inc., where responsibilities involved supply chain management and cost negotiation, and serving as Sr. Engineer at Bourns, Inc. with a focus on semiconductor assembly processes. Earlier roles include Sr. Engineer of Sales and Manufacturing Engineering at Tong Hsing Electronic Ind., and Technical Sales Manager at Technical Books, where engineering program support and business development were key responsibilities. Currently pursuing a Master's degree in Engineering/Industrial Management at National Taiwan University of Science and Technology.
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