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Ashish Pal is a highly experienced professional in the semiconductor and materials field, currently serving as the Modeling Technical Team Lead at Applied Materials since March 2017. Prior to this role, Ashish worked at Intermolecular as a Senior Scientist, focusing on alternative technologies and materials for advanced memory and logic applications from May 2015 to March 2017. Earlier positions include Scientist III and Device Engineer III at Applied Materials, as well as a Technical Intern role involving MOCVD Growth Optimization. Ashish's experience also encompasses a Graduate Technical Internship at Intel Corporation, where the focus was on the characterization of 20nm NAND Flash. Educational qualifications include a PhD in Electrical Engineering from Stanford University and advanced degrees in Microelectronics and Electronics & Telecommunication Engineering from the Indian Institute of Technology, Bombay, and Jadavpur University, respectively.