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CC Lee has extensive experience in hardware engineering and leadership roles within the technology sector. Currently serving as the Head of Hardware Engineering for Ring Asia at Amazon since April 2020, CC Lee oversees the research and development team and activities for the Ring Core product line in Taiwan. Previously, CC Lee held various leadership positions at ÖÇ°î¿Æ¼¼, including President and Sales Vice President & World Wide System Architecture Officer, focusing on networking communication and cloud computing system design. Additionally, CC Lee has experience as R&D Vice President at Accton and as a Technical Manager at Advanced Micro Devices, specializing in FPGA design and hardware systems. CC Lee began the career as an engineer at D LINK, working on network ASIC design and hardware architecture. CC Lee holds a Master's degree in Electrical Engineering from National Tsing Hua University and a Bachelor's degree in Mechanical Engineering from National Chiao Tung University.