David Youm is a seasoned engineering professional with extensive experience in packaging engineering across multiple companies in the semiconductor industry. Currently serving as a Principal Packaging Engineer at Allegro MicroSystems since April 2019, David Youm specializes in Cu pillar bump WLCSP and Flip Chip Packaging development for MOSFET Power devices and Pb-free solder bumping WLCSP packaging for automotive sensor products. Prior roles include Principal Packaging Engineer at Knowles Corporation, where David Youm developed MEMS Microphone packages, and extensive experience at Skyworks Solutions, Maxim Integrated, STATS ChipPAC Ltd., and Amkor Technology. David Youm holds educational credentials from Thayer School of Engineering at Dartmouth and Portland Community College.
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